Partner Websites: residues (Page 5 of 13)

Selective vs Manual Soldering

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/selective-vs-manual-soldering

: • Soldering result is only as good as the person who produces it • Reproducibility is not guaranteed • Extreme flux residues can result from manual soldering

ASYMTEK Products | Nordson Electronics Solutions

Technologies Options

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options?page=2

. Solder Nozzle Cleaning Removes oxidation residues and re-tins the nozzle surface without overspray of machine or printed circuit board eliminating contamination

ASYMTEK Products | Nordson Electronics Solutions

Soldering onto Platinum Pins - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/soldering-onto-platinum-pins/

. Thirdly, depending upon the flux selected, evaluate the cleaning necessary to remove all flux residues. This is an important step as perhaps the flux will be a most aggressive material and will need to be completely removed to prevent reliability issues in the short and long term of the operational

Circuit Board Voids & PCB Delamination-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml

& PCB Delamination From:    Author:    Publish time:2021-08-31 17:39    Clicks:16 Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder before it solidifies

Excess Flux Causing Intermittent Connection Issues - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/excess-flux-causing-intermittent-connection-issues

. In Rev E of the document it is in section 10.6.4 Cleanliness – Flux Residues – No-Clean Process – Appearance, which is in section

PCB Libraries Forum : SON / QFN Calculations

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_son-qfn-calculations_topic889.xml

; We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible. 

PCB Libraries, Inc.


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