Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Various process techniques have been employed to reduce voiding including reflow profile modifications, nitrogen atmosphere reflow, and implementation of special solder paste formulations and stencil designs [17
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Various process techniques have been employed to reduce voiding including reflow profile modifications, nitrogen atmosphere reflow, and implementation of special solder paste formulations and stencil designs [17
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Various process techniques have been employed to reduce voiding including reflow profile modifications, nitrogen atmosphere reflow, and implementation of special solder paste formulations and stencil designs [17
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
in the electronics rework end repair Industry. He received his training through the Navy's Micro-Miniature (2M) Elecltronic Repair Program. He has progressed through every level of rework end repair recognized in the Industry. Norman has also earned
