Partner Websites: rf can coplanarity (Page 1 of 16)

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow

KingFei SMT Tech | http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow

KingFei SMT Tech | https://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

Gold Removal on Bottom Only SMT RF Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components

: We have some RF components that are “bottom only” and the castellations are gold. Is there anything we can do about the 75% gold removal rule?   Question: We have some RF components that are

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating | No

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-research-evaluates-the-effects-of-rf-plasma-processing-prior-to-conformal-coating

(formerly known as Desich SMART Center). The paper can be downloaded here . The objective of the experiment was to evaluate the effects of RF plasma processing on the conformity of coverage of conformal coating of the knee of individual Nickel-Palladium-Gold (Ni-Pd-Au

ASYMTEK Products | Nordson Electronics Solutions

J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues

: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry

Reflow Soldering | SMT Reflow Common Defects and Treatment-News-Reflow oven,SMT Reflow Soldering Ove

| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print

.   In the 21st century, reflow soldering equipment has become a key industrial processing aid. Not only can it help factories of different natures, improve work efficiency and production efficiency, but also bring some help to business operations

ECSS-Q-ST-70-18C

| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf

ECSS-Q-ST-70-18C ECSS-Q-ST-70-18C 15 November 2008 Space product assurance Preparation, assembly and mounting of RF coaxial cables

Reflow Soldering | SMT Reflow Common Defects and Treatment-News-Reflow oven,SMT Reflow Soldering Ove

| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml

.   In the 21st century, reflow soldering equipment has become a key industrial processing aid. Not only can it help factories of different natures, improve work efficiency and production efficiency, but also bring some help to business operations

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf

) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control

Heller Industries Inc.

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