KingFei SMT Tech | http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html
KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html
KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
: We have some RF components that are “bottom only” and the castellations are gold. Is there anything we can do about the 75% gold removal rule? Question: We have some RF components that are
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-research-evaluates-the-effects-of-rf-plasma-processing-prior-to-conformal-coating
(formerly known as Desich SMART Center). The paper can be downloaded here . The objective of the experiment was to evaluate the effects of RF plasma processing on the conformity of coverage of conformal coating of the knee of individual Nickel-Palladium-Gold (Ni-Pd-Au
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. In the 21st century, reflow soldering equipment has become a key industrial processing aid. Not only can it help factories of different natures, improve work efficiency and production efficiency, but also bring some help to business operations
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/combining-2d-and-3d-aoi-the-most-effective-inspection
. The coplanarity of height-sensitive devices, such as BGA packages and leaded components, can be inspect-ed in 2D using multi-angled colored lighting and side-angle cameras
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
ECSS-Q-ST-70-18C ECSS-Q-ST-70-18C 15 November 2008 Space product assurance Preparation, assembly and mounting of RF coaxial cables
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. In the 21st century, reflow soldering equipment has become a key industrial processing aid. Not only can it help factories of different natures, improve work efficiency and production efficiency, but also bring some help to business operations
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control
