Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
component placement Too much paste has been applied to pads Preheat temperature is not high enough Solder bridging causes electrical shorts, which can make printed circuit boards malfunction during use
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Solder balls are conductive materials, meaning that if they roll around on a printed circuit board, they can cause electrical shorts, adversely affecting the reliability of a printed circuit board
| https://unisoft-cim.com/solder.php
PCB Selective Soldering Machine Programming Software ( flux / solder files) Thru-hole THD | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
. It has been seen, over the years, that BGA components do warp and many times creates shorts in the center of the device itself. Based upon the size of the component, when this happens, the edges of the components are rising up off the surface of the PCB
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/solutions/pcb-assembly
(from Nordson DAGE and Nordson MATRIX) to analyze the critical solder joints of these new-generation packages. AOI, combined with Conformal Coat and SPI inspection, are the best technologies for identifying the PCB shorts, PCB voids, opens, misalignments and solder integrity of area-array chip packages
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-assembly-how-does-it-work/
. During this inspection step, you are checking the PCB for loose solder balls, shorts, or bridges between solder balls. The Final Step in the PCB Assembly Process Testing PCBs at various stages throughout the assembly process is essential to avoid situations where defects are found at the last moment
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-46-open-connections-found-on-bga-components
SolderTip #46: Open Connections Found on BGA Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Component Contamination Board Contamination Pad Size Mismatch Cause Open Joint DEFECT Tombstoning Voids Solder Wicking Non-Wetting Incomplete Fillets Poor Strength Solder Shorts Solder Balls
Lewis & Clark | http://www.lewis-clark.com/product/spea-4040-flying-probe/
; 24 lines / sec • Local Area Network System connection with RJ45, driver and Lan interface for 4040 • V/I Generator; Precision Driver, 4Q, ±10V, ±1A • V/I Generator
PCB Libraries, Inc. | http://www.pcblibraries.com/products/fpx/userguide/default.asp?ch=1.7
Denmark France Germany Italy Netherlands Sweden U.K. North America Canada USA Contact Us Footprint Expert User Guide Training & Webinars PCB Footprint Expert - USER GUIDE The Footprint Expert uses IPC-7351 compliant mathematical models, and IPC-J-STD-001 compliant solder joint goals
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