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. Temperature Treatment - Cube for hot function test 60 °C up to 140 °C for cooling to room temperature for cold function tests -50 °C upt to -10 °C Temperature pre-treatment for electronic components and modules for functions tests
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. S olders have low melting points. At room temperature, solder behave as other metals would do at high temperature. Large amounts of deformation can occur and under load the material continues to extend
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– introducing stress to the board. To avoid these failures, it is important to follow the curing practice that best fits your application. Room Temperature Cure Room temperature curing is a slow process that can take hours or even days to finalize
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: Many gasketing materials are classified as room temperature vulcanization (RTV). These materials cure at room temperature by simply coming into contact with the moisture in the air
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. Should solder paste be used direct from refrigeration? No. Solder paste should be used at “room temperature.” This will assure intended viscosity and prevent potential condensation
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. The function of the heating system is to heat the PCB board from room temperature to the melting of the solder paste. The heating system of the full hot air reflow furnace mainly includes motor, heating tube, wind wheel, rectifier plate and other parts 3. Cooling system
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(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
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