Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
Time (9:30am - 11:00am US Eastern Time) Presenter: Stefan Strixner, ZESTRON Europe Free for members! Overview In case of malfunctions of electrical assemblies in the field a proper failure analysis to identiy its root cause and define future avoiding
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
fabrication, assembly and test. About the Instructor: Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process, legislative and
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Practical Guidelines in Handling Moisture Sensitivity of SMT Packages Mumtaz Bora Free! 2019 Improving Reliability of Assemblies from a Soldering Materials Development Standpoint Shantanu Joshi Free! 2019
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. All references, both personal, professional, and relative to product details will be removed from the discussion. SMT Components During Reflow Float Off Pads QUESTION Question
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
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