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Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. There are additional details of alloy and flux performance not covered that can be very important in the selection process. It is always worth a call to your Nordson EFD solder sales specialist to review requirements to ensure you are using the best solder paste for the job. Step 1
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Unfortunately, there are numerous causes that can produce solder bridging. To produce as quickly and efficiently as possible, finding the root cause of this defect is critical
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. However, this type of removal is not effective when the root cause stems from misprinted PCBs and pre-reflow solder paste issues. As a result, it is best to diagnose the cause of solder balls as early as possible, as these processes can negatively influence your PCB manufacturing and production
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-frequently-asked-questions
Solder Products : Frequently Asked Questions | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
) is compared to the “tent” or “straight ramp” pattern. While the former is suitable for solder pastes that require dwells at specific temperatures, the growth in the use of no-clean pastes demands more controlled high temperature periods lest the flux be depleted. a. b
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
) is compared to the “tent” or “straight ramp” pattern. While the former is suitable for solder pastes that require dwells at specific temperatures, the growth in the use of no-clean pastes demands more controlled high temperature periods lest the flux be depleted. a. b
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