ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/solder-paste-and-soldering-equipment?con=t&page=6
. Infrared Preheating Nordson SELECT The Topside Infrared Preheater is designed to maintain the temperature of a PCB during the soldering process significantly improving solder quality
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Tuttle, Cree, Inc. High Power LED Solder Joint Reliability Session 1 - Predicting Component Life + Under harsh environmental conditions like corrosion, radiation, high temperature and vibration, the aging of components is drastically accelerated. Dr
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_wave_solder_vitronics.html
: Not included Preheat Specifications: Heating Length: 1 x 0.7 meter, seperate set-point and closed loop control on element temperature
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_wave_solder_vitronics.html
: Not included Preheat Specifications: Heating Length: 1 x 0.7 meter, seperate set-point and closed loop control on element temperature
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/PCD-Dispense-Technology.pdf
. The cavities are a known volume making it easy to measure the volume through a portion of the dispense cycle. Since the pump is a volumetric pump it is not greatly affected by changes in viscosity due to pot life change or environmental temperature fluctuation
GPD Global | https://www.gpd-global.com/pdf/pump/PCD-Dispense-Technology.pdf
. The cavities are a known volume making it easy to measure the volume through a portion of the dispense cycle. Since the pump is a volumetric pump it is not greatly affected by changes in viscosity due to pot life change or environmental temperature fluctuation
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
. Underfill is typically used for applications in high shock environments or when consistent reliability is required. Die for underfill PCD Volumetric Pump for large device Capillary Underfill Dispensing Process Overview The Underfill process requires substrates to be at an elevated temperature for proper processing
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
. Underfill is typically used for applications in high shock environments or when consistent reliability is required. Die for underfill PCD Volumetric Pump for large device Capillary Underfill Dispensing Process Overview The Underfill process requires substrates to be at an elevated temperature for proper processing
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
. Underfill is typically used for applications in high shock environments or when consistent reliability is required. Die for underfill PCD Volumetric Pump for large device Capillary Underfill Dispensing Process Overview The Underfill process requires substrates to be at an elevated temperature for proper processing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/mixers/in-line-plastic-mixers
. Series 140 Disposable Plastic Tube Mixers Ideal for messy or short pot life adhesives, EFD Series 140 mixers’ low-cost, all-plastic assembly allows disposal of the mixer instead of solvent purging or baking. The
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