| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-iron-tip-temperature
. As for the alloy being used, the 63/37 is liquidus at 183C and the new RoHS alloys, such as SAC305 and Sn100C have a liquidus temperature around 215C
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. The solder paste, components and the board metallization used in the experiment are shown in Table 2. Table 1. Experiment matrix SAC305 230 240 250 Peak Temperature (°C
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. The solder paste, components and the board metallization used in the experiment are shown in Table 2. Table 1. Experiment matrix SAC305 230 240 250 Peak Temperature (°C
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-1-2-mm/
. They can prevent bridging even at bridging prone conditions such as low iron tip temperature for or fast sliding speed. Inhibits erosion of Fe plating Co added to S03X7Ca-72M forms a barrier layer at the iron tip surface, which inhibits erosion of the tip
| https://pcbasupplies.com/hand-soldering-rework/page/2/
$ 93.85 Add to cart JM-20 Sn63/Pb37 – 1.6 mm No Clean Leaded Flux Cored Solder Wire $ 93.85 Add to cart Lead-Free Low Temperature Solder Paste
| https://pcbasupplies.com/solder-paste/page/2/
$ 93.85 Add to cart Lead-Free Low Temperature Solder Paste $ 66.15 Add to cart Lead-Free Solder Paste -SAC305 Jet Dispensable Solder Paste
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
! Dual Lane, Dual Temperature Reflow Oven Pressure Curing Ovens & Back-end Semiconductor Pressure Curing Oven (PCO 860) Voidless / Vacuum Fluxless / Formic Acid Soldering Have a Special Application
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
