Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
shear force of SnPb joints Residual Plot for Shear Force of SAC305 Solder Jointresidualpredicted Shear Force-3000-2000-10000100020003000024681 0 1 2 ( X 1 0 0 0 ) Figure 5. Plot of residuals versus predicted shear force of SAC305 joints The ANOVA table
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
shear force of SnPb joints Residual Plot for Shear Force of SAC305 Solder Jointresidualpredicted Shear Force-3000-2000-10000100020003000024681 0 1 2 ( X 1 0 0 0 ) Figure 5. Plot of residuals versus predicted shear force of SAC305 joints The ANOVA table
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Hersh Kohli, Motorola, Illinois "E-Manufacturing Software for Product and Process Real-Time Monitoring" 2000: Andrew Mawer, Motorola SPS, Texas "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect" 1999
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Ph.D, Sitaram Arkalgud, Ph.D, and Eric Tosaya Abstract 29-1 Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk, and
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
No correlation was found between void size and solder joint integrity (Figure 3) Figure 3. Solder Joint Voiding Versus Cycles to Failure for CSP84 Component [6
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
No correlation was found between void size and solder joint integrity (Figure 3) Figure 3. Solder Joint Voiding Versus Cycles to Failure for CSP84 Component [6
| 1 |
