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instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications. 3V VOIDS AND CRACKS Nordson SONOSCAN Ceramic Cutting Tool Voids and Cracks - Application Note 2470 VOIDS AND DELAMINATIONS Nordson SONOSCAN Ceramic Chip Capacitor Acoustic Microscope Image and Cross
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Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083 Sample & Method A set of five multilayer ceramic chip capacitors were imaged on the C-SAM instrument using a 50 MHz
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compromise the hermiticity of MEMS devices. Sonoscan's C-SAM® acoustic microscope technology delivers the next generation of innovation for MEMS inspection, finding the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=2
acoustic microscope technology delivers the next generation of innovation for MEMS inspection, finding the… AW300CSAM Nordson SONOSCAN Materials an Composites Nordson SONOSCAN Invisible defects such as surface cracks, voids, delaminations and internal porosity flaws can ruin the performance of a component
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acoustic microscope technology delivers the next generation of innovation for MEMS… Electronics - Assembly and Packaging Nordson SONOSCAN Medical, Life Science and Pharmaceutical Nordson SONOSCAN Simultaneous Transmission and Reflection Mode (STaR)™
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t
compromise the hermiticity of MEMS devices. Nordson Test & Inspection's C-SAM® acoustic microscope technology delivers the next generation of innovation for MEMS
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acoustic microscope technology delivers the next generation of innovation for MEMS inspection, finding the… Lighting and LED Nordson SONOSCAN 1 2 3 4 5 Next
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) 3D Acoustic Microscope Image - Application Note 2515 DELAMINATIONS Nordson SONOSCAN Solar Cell to Patterned Metal Buss Bar Delaminations - Application Note 903 DELAMINATIONS Nordson SONOSCAN Solar
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Acoustic Microscope Image and Cross-Section - Application Note 2083 DELAMINATIONS AND VOIDS Nordson SONOSCAN Bonded Wafer Delaminations and Voids - Application Note 419 C-SAM AND Q-BAM Nordson SONOSCAN
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… Nordson YESTECH GEN6™ C‑SAM® Acoustic Microscope The most sophisticated and fully featured C-SAM acoustic microscope for laboratory analysis and specialized high resolution applications
