Partner Websites: scanning electron microsope (Page 1 of 2)

Effects of Cl2, NO2, Rh and Temperature on Accelerated Silver and Copper Corrosion in Mixed Flowing

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5027

. Cathodic reduction was used to quantitatively determine Ag and Cu corrosion products. Scanning electron microscopy was applied to compare surface morphologies of metal films under various test conditions

Surface Mount Technology Association (SMTA)

The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial I

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246

. In earlier synchrotron X-ray diffraction (XRD) studies and differential scanning calorimetry (DSC) of sample powders it was found that the Ni suppresses the polymorphic transformation of this intermetallic from the hexagonal to the monoclinic form that is otherwise the stable phase at temperatures below 186°C

Surface Mount Technology Association (SMTA)

Upcoming Expos

Surface Mount Technology Association (SMTA) | https://www.smta.org/expos/

. BlueRing Stencils/Stone Mountain Tool Conductive Containers Creative Electron, Inc. Fuji America Corporation Garland Service Company Horizon Sales KIC Koki Solder America Inc. Kurtz Ersa, Inc

Surface Mount Technology Association (SMTA)

Microstructure and Performance of Micro CU Pillars Assemblies

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722

. Microstructure analysis (e.g. Ag3Sn precipitate morphology) was performed with both optical and scanning electron microscopy. The effects of thermal aging on the growth of intermetallic compounds (IMCs

Surface Mount Technology Association (SMTA)

The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218

. The initial surface mount solder joint assembly quality was documented with x-ray inspection and metallographic cross-sectional analysis using optical and scanning electron microscopy to characterize

Surface Mount Technology Association (SMTA)

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296

(destructive cross-sectional analysis), and scanning electron microscopy (SEM). Complete Author List: Richard Coyle, Dave Hillman, Charmaine Johnson, Richard Parker, Michael Osterman, Brook Sandy-Smith, Babak Arfaei, Hongwen Zhang, Jie Geng, Keith Howell, Joe Smetana, Stuart Longgood, Andre Kleyner

Surface Mount Technology Association (SMTA)

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb

Heller Industries Inc.

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf

). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb

Heller Industries Inc.

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

from the temperature cycling chambers for failure analysis. The solder joint quality and microstructure were documented using optical and scanning electron microscopy. The SEM was operated in the backscattered electron imaging (BEI) mode to differentiate

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

from the temperature cycling chambers for failure analysis. The solder joint quality and microstructure were documented using optical and scanning electron microscopy. The SEM was operated in the backscattered electron imaging (BEI) mode to differentiate

Heller Industries Inc.

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