KingFei SMT Tech | https://www.smtspare-parts.com/sale-8499157-juki-ke2020-smt-serial-parallel-cable-asm-flexible-second-hand-e93237290a0.html
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GPD Global | https://www.gpd-global.com/pdf/doc/Side-Mount-Loader-Unloader-Guide-24000600.pdf
Side-Mount Loader and Unloader User Guide Loader & Unloader User Guide Version 2.1 November 13, 2017 Part No: 24000600 for Side-Mount models
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Side-Mount-Loader-Unloader-Guide-24000600.pdf
Side-Mount Loader and Unloader User Guide Loader & Unloader User Guide Version 2.1 November 13, 2017 Part No: 24000600 for Side-Mount models
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_creating-a-centroid-cpl-file-bottom-side-data_topic2611.xml
. So two components on top of each other (one on the top, one mirrored the bottom side) have identical coordinates and identical rotation.The second convention is the perspective of someone who actually holds the PCB in his hands
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2611&OB=ASC.html
Creating a Centroid /CPL file- Bottom side data - PCB Libraries Forum Forum Home > General > General Discussion New Posts FAQ Search Events Register Login Creating a Centroid /CPL file- Bottom side data
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. The second is the application of solder alloys with different melting points. The alloy with a higher melting point is used for the first side and the alloy with a lower melting point is used for the second side
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-quality device side must be mounted on the process first, the second side should be reflow soldered. The large mass 8 and mass devices that have been soldered at the bottom are protected to prevent the large mass devices from falling off due to secondary reflow. 5
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; in rare cases parts on the bottom or "second" side of the board may be secured with a dot of adhesive to keep components from dropping off inside reflow ovens if the part has a large size or
| http://etasmt.com/te_news_bulletin/2020-03-28/14961.chtml
. The second is the application of solder alloys with different melting points. The alloy with a higher melting point is used for the first side and the alloy with a lower melting point is used for the second side
| http://etasmt.com/cc?ID=te_news_bulletin,9561&url=_print
; in rare cases parts on the bottom or "second" side of the board may be secured with a dot of adhesive to keep components from dropping off inside reflow ovens if the part has a large size or
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