| http://etasmt.com/te_news_bulletin/2020-03-28/14961.chtml
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
| http://etasmt.com/cc?ID=te_news_bulletin,16161&url=_print
. As a result, engineer around the world calculate the time of the every PCB board in reflow oven is about 210 second. That means every reflow oven's chain speed must control neither to fast nor to slow
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/5309.html
EQUIPMENT Equipment Accessories REFLOW FURNACE MPM DEK Rehm HELLER OTHER PARTS CONTACT US SURFACE MOUNT SYSTEM Product number:03113144-01 Description
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/5328.html
EQUIPMENT Equipment Accessories REFLOW FURNACE MPM DEK Rehm HELLER OTHER PARTS CONTACT US SURFACE MOUNT SYSTEM Product number:03115109-01 Description
| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies
. I know this was incorrect, but that is the way we used to do it. This allowed us to fabricate the board with a fused tin/lead electroplate, (1 reflow cycle), wave solder (second reflow cycle
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
. In order to get the best profile, temperature rising rate is recommended to be 0.5~1?/second; for traditional profile, it is better to use a rate of 3~4?/second. Reflow soldering
| http://etasmt.com/cc?ID=te_news_bulletin,17761&url=_print
-quality device side must be mounted on the process first, the second side should be reflow soldered. The large mass 8 and mass devices that have been soldered at the bottom are protected to prevent the large mass devices from falling off due to secondary reflow. 5
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
. In order to get the best profile, temperature rising rate is recommended to be 0.5~1?/second; for traditional profile, it is better to use a rate of 3~4?/second. Reflow soldering
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
. In order to get the best profile, temperature rising rate is recommended to be 0.5~1?/second; for traditional profile, it is better to use a rate of 3~4?/second. Reflow soldering
| http://etasmt.com/cc?ID=te_news_bulletin,16761&url=_print
. When the rail is deformed, you must know what will happen next. The second, you can found many reflow oven's motor often broken. Because when use the reflow oven along time, there has a lot of flux melt into the motor compartment, then become solid
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