PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/PADS-Standard-Layout.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/CADSTAR.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/EAGLE.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/Pulsonix.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Allegro.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Board-Station.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/CADSTAR.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/CADint.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/CR-5000_CR-8000.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/CircuitStudio.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
