PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/DesignSpark.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/DipTrace.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/EAGLE.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Expedition.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/KiCad.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Librarian.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/McCAD.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/OrCAD-Layout.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/OrCAD-PCB.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/P-CAD.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
