PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/PADS-Professional.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/PADS-Standard-Layout.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Pantheon.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Proteus.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Pulsonix.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/SoloPCB.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Ultiboard.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Xpedition.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/eCADSTAR.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
PCB Libraries, Inc. | http://www.pcblibraries.com/products/fpx/altium.asp
. 5-Tier Density Variations Supported 1 IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
