shadow moire - SMT Electronics Manufacturing

Partner Websites: shadow moire (Page 1 of 1)

I.C.T 3D Spi smt Solder Paste inspection machine I.C.T-S400 - Dongguan Intercontinental Technology C

| https://www.smtfactory.com/I-C-T-3D-Spi-smt-Solder-Paste-inspection-machine-I-C-T-S400-pd49143724.html

: Quantity: Inquire Add to Basket Product Description I.C.T Global Service Packing and Delivery Video On-Line SPI Machine Introduction: I.C.T 3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher

I.C.T-S400 | 3D SPI SMT Solder Paste Inspection Machine from China manufacturer - I.C.T SMT Machine

| https://www.smtfactory.com/I-C-T-S400-3D-SPI-SMT-Solder-Paste-Inspection-Machine-pd49143724.html

I.C.T Global Service Video I.C.T-S400 | 3D SPI SMT Solder Paste Inspection Machine Overview On-Line SPI Machine Introduction: I.C.T 3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher

LED Manufacturing Line 0.67um Accurancy SMT SPI Machine

| https://www.feedersupplier.com/sale-13240673-led-manufacturing-line-0-67um-accurancy-smt-spi-machine.html

. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

LED Manufacturing Line 0.67um Accurancy SMT SPI Machine

| http://www.feedersupplier.com/sale-13240673-led-manufacturing-line-0-67um-accurancy-smt-spi-machine.html

. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

550KG IP2X 3 Dimensional Measurement SMT SPI Machine

| https://www.feedersupplier.com/sale-13240697-550kg-ip2x-3-dimensional-measurement-smt-spi-machine.html

.It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4