ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0304-smart-card-coil
. Gating a planar C-SAM image at the die surface level (top image) showed that the delaminations are between the die surface and the mold compound
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2566-die-surface-delaminations
. Gating a planar C-SAM image at the die surface level (top image) showed that the delaminations are between the die surface and the mold compound
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4717
(bottom solder joints (SnPb paste/SAC305 solder balls) exhibited excellent TMF performance (η = 2600 ±200 cycles; Β = 7.6 ±3.5) as did the middle (η = 2500 ±300 cycles; Β = 6.6 ±3.4) and top joints (η = 2600 ±200 cycles; Β = 8.7 ±4.0). The 100% SAC305 test vehicle showed comparable
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_footprint-calculator_topic897.xml
. A print out feature would be helpful!RLS2004 Footprint Calculator : Thanks for the new Print feature,... Author: sgdaviesSubject: 897Posted: 04 Jul 2013 at 12:59amThanks for the new Print feature, Just showed my German Colleague, he is really happy, and if he is happy i'm happy
| http://etasmt.com/cc?ID=te_news_bulletin,23578&url=_print
heating utilizes continuous operation thermal profiles for low COO and high UPH. Recent customer installation showed 10X reduction in voids, meeting specification of <1
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_library-expert-2017-19-released_topic2237.xml
Layout:BGA component family – fixed an issue where unpopulated pins showed up in the Part TypeXpedition:Fixed a problem with non-plated slotted holes that used circular pads smaller than the hole sizeAllegro/OrCAD
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/events/ipc-apex-expo-2015
. This system is modular, and will be showed combined with a conveyer and a stacker. IPC APEX will also see the Americas launch of the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/events/ipc-apex-2020
. This system is modular, and will be showed combined with a conveyer and a stacker. IPC APEX will also see the Americas launch of the DAGE Prospector ™
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/s-dim-for-dfn-2-pin-avago-template-request_topic558_post1783.html
& Avago template request Posted: 17 Sep 2012 at 8:32am Thanks Tom, I'll e-mail you an Avago template directly. To be honest I did stop for a second on the Diode Side Concave calculator but moved quickly on because picture showed a four pin device with an "e" dimension so I just assumed there wouldn't be a two pin version
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/s-dim-for-dfn-2-pin-avago-template-request_topic558_post1785.html
. To be honest I did stop for a second on the Diode Side Concave calculator but moved quickly on because picture showed a four pin device with an "e" dimension so I just assumed there wouldn't be a two pin version
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