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: Thermal Interface Materials (TIM) Thermal Compound 52050 Data sheet Nordson EFD Silicone-Free Thermal Interface Material Nordson EFD Thermal Compound 52051 Nordson EFD Silicone-Free Thermal Interface Material Thermal Compound 52054
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
2.0W/m-K Gap Pad 3000 0.020” - 0.20” thk 3.0W/m-K Thickness ranges from 0.005” to 0.200” All materials available with pressure sensitive adhesive Sil-Pad Sil-Pad 400 Sil-Pad 1000 Sil-Pad 2000 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Q-Pad Q-Pad II Q-Pad 3 Construction Silicone/Fiberglass
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/thermal-compounds?con=t
Us Support Suppliers Resources Careers Thermal Compounds Nordson EFD's innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer
