ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Activator is consumed by heat over time. Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. Plating and lithography techniques can be used during front end manufacture to build bump and pillar structures. In addition, solder balls may also be placed or printed and then reflowed during back end manufacture before wafer dicing
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Adhesives Geoff Rivers, Pearl Lee-Sullivan, Boxin Zhao, Alex Chen, John Persic and Robert Lyn Abstract 30-3 Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Electroless Pd
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
, Akiko Takahashi, Masahiro Nomoto, and Akishi Nakaso, Hitachi Chemical Co., Ltd., Japan "Electroless Ni-P/Pd/Au Plating for Semiconductor Package Substrate" 1999: Dr. Malcolm Warwick, Multicore Solders, Ltd., England "Implementing Lead Free Soldering
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
silver’s high electrical conductivity, immersion silver (IAg) has a low signal loss. It’s also RoHS-compliant, but this finish can oxidize and tarnish
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
. Copper weights range from 1 to 4g. Finish plating can be leaded solder, or any following RoHS-compliant finishes: lead-free solder, immersion gold, immersion silver, white tin, or OSP
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Technology Development Manager, IBM Semiconductor Research and Technology Center 1999 Anita Sargent , Binghamton University (Binghamton, NY) Paper: "The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications" Where is she now
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Indium anneals at room temperature, so it is not damaged by the cyclic plastic strain between the lid and the die. Indium-silver alloys (k~70 W/m-K
