Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
ORION Industries | http://orionindustries.com/pdfs/kapton.pdf
4.0 ASTM D-570-92, using Absorption, %, 24-hr immersion at 23°C (73°F). max. Average of three specimens. **Also applies to Type VN, except shrinkage, which is shown in Table 5
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
] that the immersion silver surface finish selected for lead-free PCBs had the susceptibility to creep corrode when used in high sulfur and high humidity environments
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements (e.g
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Activator is consumed by heat over time. Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
Safety Interlocks (pg 5.112). X X Touch pad Clean the touch pad on the calibration sta- tion. Refer to CLEAN Touch Pad (pg 5.69). X Vision calibration dot label For calibration station models prior to 2010 (not applicable to compact model) 1. Replace the
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
limit switches Visually inspect optical limit switches.† They should be free of debris, securely mounted, and in good operating condition. Refer to TEST Safety Interlocks (pg 5.112). X X Touch pad Clean the touch pad on the calibration sta- tion. Refer to
