Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with
ORION Industries | http://orionindustries.com/pdfs/kapton.pdf
4.0 ASTM D-570-92, using Absorption, %, 24-hr immersion at 23°C (73°F). max. Average of three specimens. **Also applies to Type VN, except shrinkage, which is shown in Table 5
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
cleanliness, absence of oil films and freedom from tarnish or corrosion. 5.1.2 Environmental conditions a. The supplier shall have an assembly area which has a controlled environment that limits entry of contamination. b. The supplier shall
