Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
Monel Nichrome Nickel Nickel Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Key Recommended Alloy Specific (contact EFD
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Monel Nichrome Nickel Nickel Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Key Recommended Alloy Specific (contact EFD
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
. Cost In the world of printed circuit boards, you get what you pay for. Generally, the more expensive PCB finishes like electrolytic wire bondable gold, electrolytic hard gold, and electroless nickel electroless palladium immersion gold (ENEPIG
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Electroless nickel electroless palladium immersion gold (ENEPIG) has a high solder strength and reduces corrosion, but it requires greater care in processing to achieve the best performance
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
J. Turbini Abstract 26-2 Solder Alloy Creep Constants for Use in Thermal Stress Analysis Robert Darveaux, Ph.D. and Corey Reichman Abstract 26-2 A Nano Silver Replacement for High Lead Solders in Semiconductor Junctions Keith Sweatman, Tetsuro
