Heller Industries Inc. | https://hellerindustries.com/video/
– The IPC CFX Showcase Heller Industries at Cloud 9 Sinerji/ Heller SMT Reflow Ovens – Lead Free Mark III Series 788 Vertical Curing Oven PCO 860 Pressure Cure Oven VCO 755 In-line, Continuous Cure, Vertical Format Mini Curing Oven 1936 MKV Vacuum Reflow Oven Formic Acid Sintering
Heller 公司 | http://hellerindustries.com.cn/videos.php
: Formic Acid Sintering Real Time with... David Heller, President of Heller Industries at IPC APEX 2015 Heller Industries Factory in Korea The main principle of Heller Korea is to be able to meet any customer's request despite the assumption
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
in the boundary region at a bonding interface. Today, the effect has been taken into account in various fields in materials science and technology such as structural materials welding, metals and ceramics powders sintering, thin films, and large-scale integration
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
in the boundary region at a bonding interface. Today, the effect has been taken into account in various fields in materials science and technology such as structural materials welding, metals and ceramics powders sintering, thin films, and large-scale integration
| https://productronica.com/en/trade-fair/press/press-releases/detail/here-are-the-winners.html
Buße, Managing Director: “We are delighted to receive this award and see it as confirmation of our work on innovative solutions for the soldering and sintering process
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
. Typical PCO Applications Die Attach Curing Underfill Curing Ag Sintering Cure MEMS Sealing Taping / Lamination PCB Via Fill Encapsulation Curing Composite Forming Click here to learn more about our
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Alternative solder alloys designed for higher temperatures are needed. Mathias Nowottnick of the University of Rostock will present on transient liquid phase sintering research by combining solid copper powder and liquidus SnAgCu solder
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