PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_3d-step-to-vrml_topic976.xml
so if they've an error input values then it's probably going to be a wrong pitch which would be same on both model and footprint, or the wrong ball diameter.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic976&OB=DESC.html
time so if they've an error input values then it's probably going to be a wrong pitch which would be same on both model and footprint, or the wrong ball diameter
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic976.html
time so if they've an error input values then it's probably going to be a wrong pitch which would be same on both model and footprint, or the wrong ball diameter
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
- ray images in Figure 7a (192CABGA) and Figure 8a (84CTBGA) are typical of the extent and size of the solder voids. Note that the largest voids result in a noticeable increase in the diameter of the solidified solder spheres. Half of the population of
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
- ray images in Figure 7a (192CABGA) and Figure 8a (84CTBGA) are typical of the extent and size of the solder voids. Note that the largest voids result in a noticeable increase in the diameter of the solidified solder spheres. Half of the population of
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
- ray images in Figure 7a (192CABGA) and Figure 8a (84CTBGA) are typical of the extent and size of the solder voids. Note that the largest voids result in a noticeable increase in the diameter of the solidified solder spheres. Half of the population of
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