ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/75-mm-wave-nozzle
. - Process parameters including travel speed, soak time and solder temperature are fully controllable for individual circuit boards. - Available for tin-lead or lead-free solder alloys with lead-free solder pot constructed of titanium for resistance to corrosive alloys
Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder-2015/
– Height and travel speed of the solder wave – Programmable initial preheat soak time Condition: Extremely Low usage. Complete and Operational, available for inspection under power. Location/Shipping
Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder/
: –Solder temperature interlocked to within 10°C – Height and travel speed of the solder wave – Programmable initial preheat soak time Condition
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html
. Extensive testing revealed substantial benefits in setting up profiles in 1°C increments. Slight setpoint changes in the soak and reflow zones produced more robust profiles that reduced temperatures at hot spots on the board and provided more even heating across the assembly
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html
. Extensive testing revealed substantial benefits in setting up profiles in 1°C increments. Slight setpoint changes in the soak and reflow zones produced more robust profiles that reduced temperatures at hot spots on the board and provided more even heating across the assembly
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
), and soak time for the re-assembly reflow were 80 seconds and 65 seconds respectively. The convection zone set points are depicted in Table 2 for this re-assembly reflow process
Heller Industries Inc. | https://hellerindustries.com/heller/formic-acid-reflow-process/
. Formic acid vapor should be injected into the oven near the soak zones, and a proper formic acid profile should have the highest formic acid concentrations at the soak zones
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– pre-heat, pre-heat and soak, reflow, and cooling zone. The incorrect setup with zone temperatures and times will cause different soldering defects. Pre-heat zone
| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print
. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf
Heller Industries Inc.