46 sn-cu-ni results

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

adding each of these above additives. In addition, both time zero analysis and ATC (0-100°C) thermal reliability analysis of the Sn-Cu + Ni solder vs. SAC405 will also be discussed. Finally, the manufacturing impact when altering the Pb-free PTH alloy will

Surface Mount Technology Association (SMTA)

High Reliability Alloy Solder Paste For ENIG - PCBASupplies

| https://pcbasupplies.com/alloy-solder-paste-enig/

. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf

Wire-Bonding Reliability of Electroless Ni/Pd/Au Plating - Influence of Electroless Pd Deposition Re

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495

:  The influence of the electroless deposition of Pd in electroless Ni-P/electroless Pd/immersion Au (ENEPIG) plating was investigated on the reliability of Au and Cu wire-bonding

Surface Mount Technology Association (SMTA)

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

.  Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package

03076575-01_Suzhou Feierte electronic co.,ltd

KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/4202.html

: ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. PREVIOUS： 03076404-01 NEXT： 03076588-01 RELATED PRODUCTS CATEGORIES ABOUT US

KD Electronics Ltd.

03076575-01_Suzhou Feierte electronic co.,ltd

KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/PRODUCTSA/PARTS/4202.html

:03076575-01 Description: ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. Previous： 03076404-01 Next： 03076588-01 RELATED PRODUCTS CATEGORIES ASM EQUIPMENT Equipment Accessories PANASONIC EQUIPMENT Equipment Accessories YAMAHA EQUIPMENT Equipment Accessories FUJI EQUIPMENT Equipment Accessories JUKI

KD Electronics Ltd.

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml

.  Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml

.  Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package