| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-printed-circuit-board-bow-and-twist-showing-up
. This assembly has a 40mm PoP BGA component on it with an integrated heat sink. We are using a three zone reflow oven and the profile has worked without issue for at least six months
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| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/
. The DOE modifications could be profile temp changes, paste deposition thickness changes, paste material changes, etc. The reliability of the solder joint is not based upon the how much shear force is required to break the solder joint, but how it is designed for the environment of the operational product
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. Hi Tom, Thanks for your reply. However, I don't see how the two issues are related to my problem. jpderuiter Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined
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. Hi Tom, Thanks for your reply. However, I don't see how the two issues are related to my problem. jpderuiter Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined
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. Hi Tom, Thanks for your reply. However, I don't see how the two issues are related to my problem. jpderuiter Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined
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. Hi Tom, Thanks for your reply. However, I don't see how the two issues are related to my problem. jpderuiter Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined
