| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
– pre-heat, pre-heat and soak, reflow, and cooling zone. The incorrect setup with zone temperatures and times will cause different soldering defects. Pre-heat zone
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. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above
| http://etasmt.com:9060/te_news_industry/2021-08-31/23961.chtml
. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above
| http://etasmt.com/cc?ID=te_news_bulletin,23566&url=_print
use any reflow profile (e.g., tent or soak profile) with formic acid Can adjust formic acid profile in oven in conjunction with thermal reflow profile Includes Formic acid safety system (i.e., sensors/detectors
| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print
– Preheat, soak, reflow and cooling. The main aim being to transfer enough heat into the assembly to melt the solder and form the solder joints without causing any damage to components or PCB. Preheat
| http://etasmt.com/te_news_industry/2021-08-31/23961.chtml
. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above
| http://etasmt.com:9060/te_news_industry/2021-09-01/24361.chtml
– Preheat, soak, reflow and cooling. The main aim being to transfer enough heat into the assembly to melt the solder and form the solder joints without causing any damage to components or PCB. Preheat
| http://etasmt.com/te_news_industry/2021-09-01/24361.chtml
– Preheat, soak, reflow and cooling. The main aim being to transfer enough heat into the assembly to melt the solder and form the solder joints without causing any damage to components or PCB. Preheat
