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. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above
| http://etasmt.com/te_news_industry/2021-08-31/23961.chtml
. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above
Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder-2015/
– Height and travel speed of the solder wave – Programmable initial preheat soak time Condition: Extremely Low usage. Complete and Operational, available for inspection under power. Location/Shipping
Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder/
: –Solder temperature interlocked to within 10°C – Height and travel speed of the solder wave – Programmable initial preheat soak time Condition
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/75-mm-wave-nozzle
. - Process parameters including travel speed, soak time and solder temperature are fully controllable for individual circuit boards. - Available for tin-lead or lead-free solder alloys with lead-free solder pot constructed of titanium for resistance to corrosive alloys
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– pre-heat, pre-heat and soak, reflow, and cooling zone. The incorrect setup with zone temperatures and times will cause different soldering defects. Pre-heat zone
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. The more efficient the heat transfer during the soak phase the less time is needed. Reflow – This is the stage where the temperature within the reflow oven is increased above the melting point of the solder paste causing it to form a liquid
| http://etasmt.com:9060/te_news_industry/2021-09-01/24361.chtml
. The more efficient the heat transfer during the soak phase the less time is needed. Reflow – This is the stage where the temperature within the reflow oven is increased above the melting point of the solder paste causing it to form a liquid. The
