PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_jedec-standard-footprints_topic2063.xml
... I just assumed is was pay-to-play like IEEE papers.Can you please clarify what you mean by "very few mfr.'s use these"?The parts are created at an IC packaging facility of which several manufacturer's share the same facilities and SOT, SOIC, TSSOP, etc
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_7711-21-CIT.pdf
& MELF Removal/Installation and Localized Cleaning • Instructor Demonstration and Skills Development Lab • Gull Wing Procedures (SOIC, SOT, D-Pak, QFP
| https://www.eptac.com/class/ipc-7711-7721-instructor
& MELF Removal/Installation and Localized Cleaning Instructor Demonstration and Skills Development Lab SOIC, SOT and Gull Wing Procedures Instructor Demonstration and Skills Development Lab J-Lead and
| https://www.eptac.com/class/ipc-7711-7721-specialist
& MELF Removal/Installation and Localized Cleaning Instructor Demonstration and Skills Development Lab SOIC, SOT and Gull Wing Procedures Instructor Demonstration and Skills Development Lab J-Lead and
| https://www.eptac.com/etrainings/ipc-7711-7721-standard-expert-recertification-online/
& MELF Removal/Installation and Localized Cleaning SOIC, SOT and Gull Wing Procedures J-Lead and QFP Procedures DAY 3 BGA Removal/Replacement Discussion Equipment Selection Conformal Coating Identification, Removal
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_7711-21-CSE.pdf
& MELF Removal/Installation and Localized Cleaning • Instructor Demonstration and Skills Development Lab • Gull Wing Procedures (SOIC, SOT, D-Pak, QFP
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063_post8485.html
... I just assumed is was pay-to-play like IEEE papers. Can you please clarify what you mean by "very few mfr.'s use these"? The parts are created at an IC packaging facility of which several manufacturer's share the same facilities and SOT, SOIC, TSSOP, etc
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2063&OB=DESC.html
... I just assumed is was pay-to-play like IEEE papers. Can you please clarify what you mean by "very few mfr.'s use these"? The parts are created at an IC packaging facility of which several manufacturer's share the same facilities and SOT, SOIC, TSSOP, etc
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-standard-footprints_topic2063_post8485.html
... I just assumed is was pay-to-play like IEEE papers. Can you please clarify what you mean by "very few mfr.'s use these"? The parts are created at an IC packaging facility of which several manufacturer's share the same facilities and SOT, SOIC, TSSOP, etc
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063.html
? I am thinking of standardizing things such as SOT, SOIC, chip components, molded body caps, SM* diodes, etc. What if any standardization of footprints have any of you attempted
