| http://etasmt.com/te_news_industry/2013-07-03/5361.chtml
. 9, Production repeatability and consistency of the solder: As the electronic assembly process is a high-volume manufacturing process, requiring the repeatability and consistency to maintain a high level, if certain alloy composition is not in bulk conditions
| http://etasmt.com:9060/te_news_industry/2013-07-03/5361.chtml
. 9, Production repeatability and consistency of the solder: As the electronic assembly process is a high-volume manufacturing process, requiring the repeatability and consistency to maintain a high level, if certain alloy composition is not in bulk conditions
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/animal-health?con=t&page=5
) Solder Powder Lead-free Alloy without Antimony (US EN) Nordson EFD Powder Solder Powder Lead-free Alloy with Antimony (US EN) Nordson EFD Powder Safety Data Sheet - Solder Paste Rosin Lead-Free without Antimony (CA EN
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. The high Cu dissolution rates experienced when using SAC305/405 may dictate a change in the Pb-free alloy used during the PTH rework process, in order for typical methods of rework (i.e. solder fountain
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/applications/gluing-liquid-adhesive?con=t&page=17
(US EN) Nordson EFD Lubricant, Grease Solder Paste P925D200B3 (US EN) Nordson EFD Solder Powder Lead-free Alloy without Antimony (US EN
| https://www.eptac.com/faqs/ask-helena-leo/ask/darkened-smt-capacitor-or-resistor-terminations-after-leadfree-soldering-reflow
. To fully answer this question, we would need an investigation of the component termination metallization, the type of solder alloy being used, the manufacturer of the solder and the type of flux base
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
. Such growth can be as much as several microns during reflow. Therefore it is imperative that liquidus dwell time -the interval that the interconnection is above the melting temperature of the solder alloy, be kept as short as possible
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
(Advanced Driver Assist Systems), reliability drivers have intensified. Karthik Vijay of Indium Corporation will present on a novel solder alloy that exceeds performance requirements as compared to SAC305 alloys
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: This is a new application for components where there is a bottom pad for either thermal relief or electrical functionality. The ability to tin these pads with the proper solder alloy could impact the coplanarity of the device when it is assembled to the printed board
