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. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
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. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
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. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=25
cavity shear testing as an alternative method for applying a load to a solder ball or ball bond in shear. Enova Lyon 2018 Nordson DAGE Visit our distributor Metronelec - Stand B22 - to learn more about Nordson DAGE's award winning Bond Test and X-ray systems Micro Testing Thin Die Nordson DAGE Cold Bump
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=18
Electronic interconnects such as solder balls and wire bonds can be sheared individually using a tool accurately… 4000 Optima Bondtester Nordson DAGE The fastest and most accurate bondtester
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=21
. Ball Shear/Solder Ball Shear Nordson DAGE Nordson DAGE bondtesters perform shear tests in accordance with; JEDEC JESD22-B117, JEDEC JESD22-B116 and ASTM F1269
