46877 | https://www.nordson.com/zh-CN/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=2
ASYMTEK Products | Nordson Electronics Solutions
46877 | https://www.nordson.com/zh-CN/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=3
ASYMTEK Products | Nordson Electronics Solutions
46877 | https://www.nordson.com/zh-CN/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=6
ASYMTEK Products | Nordson Electronics Solutions
46877 | https://www.nordson.com/zh-CN/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=7
ASYMTEK Products | Nordson Electronics Solutions
Heller Industries Inc. | https://hellerindustries.com/bit_publications/effect-of-reflow-profile-on-snpb-and-snagcu-solder-joint-shear-force/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/news/frost-sullivan-lauds-heller-industries-exceptional-growth-borne-of-its-advanced-smt-reflow-soldering-equipment-for-industry-4-0/
– Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component
Heller Industries Inc. | https://hellerindustries.com/reflow-news/frost-sullivan-lauds-heller-industries-exceptional-growth-borne-of-its-advanced-smt-reflow-soldering-equipment-for-industry-4-0/
– Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. This would be related to percentage flux to metal ratio content of the paste rheology. As for the solder paste not reflowing and appearing as a solder ball grain structure on the surface of the solder paste, this is due lack of enough applied heat, which will prevent the solder paste
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2
. This would be related to percentage flux to metal ratio content of the paste rheology. As for the solder paste not reflowing and appearing as a solder ball grain structure on the surface of the solder paste, this is due lack of enough applied heat, which will prevent the solder paste
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-effect-of-vacuum-reflow-processing-on-solder-joint-voiding-and-thermal-fatigue-reliability/
– Reflow Soldering Solder Ball Defects Wicking Defects Opensor Insufficient Solder Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
