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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/ball-shear
: JEDEC JESD22-B116 - Au Ball Shear JEDEC JESD22-B117 – Solder Ball Shear ASTM F1269 - Ball Bond Shear Accurate shear testing requires
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types-2020/ball-shear
) Die typischen Kugelscherenstandards sind: JEDEC JESD22-B116 - Au Ball Shear JEDEC JESD22-B117 – Solder Ball Shear ASTM F1269 - Ball Bond Shear Genaue Scherprüfung erfordert
Heller Industries Inc. | https://hellerindustries.com/solder-shorts/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
