ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=8
Ball Shear Solder Ball Shear | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
Heller Industries Inc. | https://hellerindustries.com/parts/463146/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Unlike solder ball defects , a solder bridge can be harder to see due to the fact that they may be invisible to the eye. Using a solder mask color with high visual contrast helps makes solder bridges more apparent
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
. Kind of interesting how that problem was solved, or was it solved and we just adapted our acceptable condition and moved on? We still get questions as to the solder ball condition, but it is mostly an educational issue, or new people wanting to reinvent the wheel
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
with all their ven- dors including suppliers of placement equip- ment, screen printers, solder paste, convey- ors and reflow ovens. The sales and technical support staffs of these companies have expe- rienced literally thousands of applications. Hence
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
with all their ven- dors including suppliers of placement equip- ment, screen printers, solder paste, convey- ors and reflow ovens. The sales and technical support staffs of these companies have expe- rienced literally thousands of applications. Hence
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
). The BGA components were soldered to daisy chained test boards using matching alloy solder paste, and subsequently thermally cycled in accordance with the IPC-9701 attachment reliability guideline
