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Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Unlike solder ball defects , a solder bridge can be harder to see due to the fact that they may be invisible to the eye. Using a solder mask color with high visual contrast helps makes solder bridges more apparent
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
. Kind of interesting how that problem was solved, or was it solved and we just adapted our acceptable condition and moved on? We still get questions as to the solder ball condition, but it is mostly an educational issue, or new people wanting to reinvent the wheel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/solder-paste-and-soldering-equipment?con=t&page=37
™ test software provides a range of fatigue tests to determine fatigue life. IPC APEX EXPO 2021 Nordson SELECT NYTX2DSL Nordson Corporation VOIDS AND BOND DEFECTS Nordson SONOSCAN Flip Chip Underfill Void and Solder Bump Defects - Application Note 1016 Full Surface Preheating
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| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. This would be related to percentage flux to metal ratio content of the paste rheology. As for the solder paste not reflowing and appearing as a solder ball grain structure on the surface of the solder paste, this is due lack of enough applied heat, which will prevent the solder paste
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