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. J-STD-001, IPC-A-610 and IPC-A-620 all require solder to be “visible” in the inspection hole (if present). Is there a more specific requirement to this
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있습니다. 핀 이송 또는 침지 부품 또는 핀을 솔더 페이스트에 침지시켜 솔더를 도포하는 도포 기술입니다. 얇고 균일한 층의 NC 21T20 솔더 페이스트가 부품에 달라붙습니다. 이 기술은 핀 배열과 같이 프린팅 또는 디스펜싱에 적합하지 않은 제품에 솔더를 도포하는 데 유용합니다. 저공극 IPC-7097A는 BGA용 설계 및 조립 공정 구현을 위한 사양입니다. BGA(Ball Grid Array) 및 MicroBGA 검사 기준은 종종 20% 미만의
