PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10535.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2587&OB=DESC.html
PCB’s. There are two things that are important here: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2587&OB=ASC.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
Heller Industries Inc. | https://hellerindustries.com/smt-reflow-ovens/smt-reflow-oven/
– Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component
Heller Industries Inc. | https://hellerindustries.com/1913-mark-5-series-smt-reflow-oven/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
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