Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. To resolve this, ensure that your ramp-up is less than 1.5°C/sec from average room temperature to 150°C. Solder Ball Removal Spray in air systems are the best method for removing solder ball contamination
Heller Industries Inc. | https://hellerindustries.com/reflow-oven-flux-removal/
. Doubles PM interval No impact to thermal profile How it Works The reflow oven flux removal system from Heller is a low temperature integrated catalyst installed in the heat modules
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
(Restriction of Hazardous Substances) directive and sometimes it is a corporate directive. Some applications that fall under the RoHS directive are exempt from being lead-free because the reflow temperature requirements can only be met with high-lead solder alloys which are exempt under RoHS regulation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
(Restriction of Hazardous Substances) directive and sometimes it is a corporate directive. Some applications that fall under the RoHS directive are exempt from being lead-free because the reflow temperature requirements can only be met with high-lead solder alloys which are exempt under RoHS regulation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. De-soldering The removal of solder and components from a circuit, usually for purposes of repair. De-wetting A condition where molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. De-soldering The removal of solder and components from a circuit, usually for purposes of repair. De-wetting A condition where molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. This would be related to percentage flux to metal ratio content of the paste rheology. As for the solder paste not reflowing and appearing as a solder ball grain structure on the surface of the solder paste, this is due lack of enough applied heat, which will prevent the solder paste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=2
. Nordson DAGE has been at the forefront of such testing since its… Nordson DAGE UV Curing App Note Nordson DAGE Bump Shear Nordson DAGE Nordson DAGE Bondtesters provide bump shear testing for use in the production test environment to remove the solder ball from a device or substrate
| https://www.feedersupplier.com/sale-15382340-00350588s04-asm-siemens-siplace-sleeve-with-ball-fixing-compl-dlm.html
: Heller, BTU, Vitronics, and some Chinese brand ovens, etc. 6. Other SMT machines & Accessories: such as laser marking machine, PCB washing machine, wave soldering machine, glue dispenser, solder paste mixer, PCB conveyor, PCB magazine loader and unloader, nozzles, feeders, drivers, controllers, etc
| http://www.feedersupplier.com/sale-15382340-00350588s04-asm-siemens-siplace-sleeve-with-ball-fixing-compl-dlm.html
: Heller, BTU, Vitronics, and some Chinese brand ovens, etc. 6. Other SMT machines & Accessories: such as laser marking machine, PCB washing machine, wave soldering machine, glue dispenser, solder paste mixer, PCB conveyor, PCB magazine loader and unloader, nozzles, feeders, drivers, controllers, etc
winsouce.jpg)
