Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Component samples sizes for the accelerated temperature cycling test matrix. Solder Joint Void Characterization and Failure Analysis Transmission x-ray inspection and metallographic cross sectional analysis were used to characterize solder joint voiding and
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Component samples sizes for the accelerated temperature cycling test matrix. Solder Joint Void Characterization and Failure Analysis Transmission x-ray inspection and metallographic cross sectional analysis were used to characterize solder joint voiding and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=2
provide high strain rate testing (up to 5kg) to apply an impact load to the solder ball so that the load is transferred down to the under bump material. High strain rate
Blackfox Training Institute, LLC | https://www.blackfox.com/4-industries-to-apply-hmp-solder-training/
4 Industries To Apply HMP Solder Training - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_blind-via-with-smaller-solder-mask-opening_topic1110.xml
? Possible to send the contact please. Many thanks. Best Regards,NB. Blind Via With Smaller Solder Mask Opening : All vias under BGA's need... Author: Tom HSubject: 1110Posted: 18 Sep 2013 at 7:04pmAll vias under BGA's need to be "Tented" with solder mask to prevent solder bridging under the component
| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print
. Process and design-related causes: • Impurity in the component plating • Impurity in the circuit board finish • Bad or expired solder paste
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/blind-via-with-smaller-solder-mask-opening_topic1110.html
: 5484 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 18 Sep 2013 at 7:04pm All vias under BGA's need to be "Tented" with solder mask to prevent solder bridging under the component
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/blind-via-with-smaller-solder-mask-opening_topic1110.html
: 5484 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 18 Sep 2013 at 7:04pm All vias under BGA's need to be "Tented" with solder mask to prevent solder bridging under the component
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
component placement Too much paste has been applied to pads Preheat temperature is not high enough Solder bridging causes electrical shorts, which can make printed circuit boards malfunction during use
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1110&OB=DESC.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5182 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 18 Sep 2013 at 7:04pm All vias under BGA's need to be "Tented" with solder mask to prevent solder bridging under the component
