| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
:2 Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
:0 Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
don’t want solder balls, don’t use solder paste because we did not have that many little tiny solder balls before, and we are not going to accept the condition now. Yup
| https://www.eptac.com/solder-tips/
Solder Pot Maintenance and Dross Removal Question: We found an article online about solder pot maintenance and the removal of dross, specifically there is an interest to us in the “changing bar solder” Section
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/all?page=2
SMD16 SMD4300TF10 SMT SMT Rework Solder Solder Ball Solder Balls Solder Bumping Solder Certification Solder Sphere Solder Training soldering SP-360C SRT SRT 1000 SRT 1000 SRT 1000 BGA Rework Station
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1016-voids-and-bond-defects
through the substrate side. Gating was on the interface between the cured underfill and the substrate, and includes the bonding of the solder balls to their pads
