390 solder criteria with via in the pad results

Blind Via With Smaller Solder Mask Opening - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/blind-via-with-smaller-solder-mask-opening_topic1110.html

 with small solder mask opening. The drill for this blind via is 0.1mm, pad is 0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA

PCB Libraries, Inc.

Blind Via With Smaller Solder Mask Opening - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/blind-via-with-smaller-solder-mask-opening_topic1110.html

 with small solder mask opening. The drill for this blind via is 0.1mm, pad is 0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA

PCB Libraries, Inc.

Blind Via With Smaller Solder Mask Opening - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1110&OB=DESC.html

 previous designer has created blind via (L8-L7) for the 8 layers board with small solder mask opening. The drill for this blind via is 0.1mm, pad is

PCB Libraries, Inc.

Blind Via With Smaller Solder Mask Opening - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1110&OB=ASC.html

 with small solder mask opening. The drill for this blind via is 0.1mm, pad is 0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA

PCB Libraries, Inc.

SolderTips: Issues With Incomplete Solder Reflow in Production | EPTAC

| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/

: I’m not exactly sure of what you mean by flux exhaustion, however; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself

SolderTips: Avoiding the Creation of Splices Via Wire Twisting | EPTAC

| https://www.eptac.com/soldertips/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/

. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help

SolderTips: Issues With Incomplete Solder Reflow in Production - EPTAC - Train. Work Smarter. Succee

| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/

; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself

SolderTips: Issues With Incomplete Solder Reflow in Production - EPTAC - Train. Work Smarter. Succee

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2

; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself

SolderTips: Avoiding the Creation of Splices Via Wire Twisting - EPTAC - Train. Work Smarter. Succee

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-avoiding-the-creation-of-splices-via-wire-twisting

SolderTips: Avoiding the Creation of Splices Via Wire Twisting - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

SolderTips: Avoiding the Creation of Splices Via Wire Twisting - EPTAC - Train. Work Smarter. Succee

| https://www.eptac.com/soldertip/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/

SolderTips: Avoiding the Creation of Splices Via Wire Twisting - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more