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second. Typical reflow methods that achieve rapid reflow include laser, solder iron, hot bar, and induction. Pin transfer or dipping An application technique where the solder is applied by dipping a component or pin into the solder paste. A thin
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Solderability The ability of metal to be wetted by solder during the reflow process. Solder Paste Homogenous mixture of powdered solder alloy and paste flux. Solder pastes are formulated for application to a product using printing, dispensing, dipping, and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
The ability of metal to be wetted by solder during the reflow process. Solder Paste Homogenous mixture of powdered solder alloy and paste flux. Solder pastes are formulated for application to a product using printing, dispensing, dipping, and jetting
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: In selecting a flux, the first thing you want to check out is: does it improve the soldering compared to the existing flux? This can be done by dipping comparative samples into each flux pot and dipping them in a solder pot and checking the soldering, i.e
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Oberflächen Allgemeine Anwendungen Halogenidfrei Bleifreie, glänzende Lötfüllung Weniger Rückstände Pintransfer oder Dipping (niedrige Viskosität) Kurze Reflow-Zykluszeit
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. When J-STD-001 mentions that the wire needs, or shall be tinned, it means the entire wire bundle must be soldered together. This can be accomplished two ways, one with a soldering iron and cored solder, or secondly with a flux dip and dipping the wire into a solder pot
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