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. The following are a few examples of flux characteristics that modify how a solder paste performs. Restricted Residue NC 26D04 flux residue remains either on or very close to the fillet after reflow. This feature is most important with NC formulations
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. Excessive preheat can reduce flux effectiveness. Printing A process for transferring solder to a surface by forcing solder paste through a stencil or screen with a squeegee
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. Preheat The process of stabilizing the work to be soldered at a temperature below the solder melting point. Excessive preheat can reduce flux effectiveness. Printing A process for transferring solder to a surface by forcing solder paste through a stencil
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. In the event that a container of solder paste would go unused after removal from refrigeration, and ambient temperature exceeds 75°F (25°C
