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Application Technologies Nordson's TEST & INSPECTION technologies are targeted for semiconductor backend, solder joint inspection, assembly and non-destructive tests
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Application Technologies Nordson's TEST & INSPECTION technologies are targeted for semiconductor backend, solder joint inspection, assembly and non-destructive tests
Lewis & Clark | https://www.lewis-clark.com/product-tag/preowned-mirtec-mv2-htl-aoi/
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Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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