Heller Industries Inc. | https://hellerindustries.com/publications/
& Articles White Papers Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/closed-loop-in-process-flux-verification
Barcode Reader Soldering Processes Process Troubleshooting Guide Application Centers Selective vs. Manual Soldering Selective vs. Wave Soldering Selective Soldering Workshops AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/in-process-flux-verification
Barcode Reader Soldering Processes Process Troubleshooting Guide Application Centers Selective vs. Manual Soldering Selective vs. Wave Soldering Selective Soldering Workshops AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-minimum-space-requirements
. If the wire is not in contact with the back wall of the cup then it is a process indicator and does not have to be fixed, by that I mean the solder joint does not have to be reflowed to reposition the wire
| http://etasmt.com/te_news_bulletin/2020-03-28/14961.chtml
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
| https://www.eptac.com/ask/soldering-minimum-space-requirements/
. If the wire is not in contact with the back wall of the cup then it is a process indicator and does not have to be fixed, by that I mean the solder joint does not have to be reflowed to reposition the wire
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
@nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
@nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
: T,S C, A Atmosphere: Nitrogen Temperature: 240°C Visually Good Joint but… … too much solder in heel is a potential failure point SOT Lead PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 22 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 14 Material
