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Addressing the Issues Around Solder Joint Voids in Surface Mount Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/aoi-solder-joint-inspection
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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