PCB Libraries, Inc. | https://www.pcblibraries.com/forum/library-expert-2016-01-released_topic1846_post7558.html
!! NEW: IPC-7351C Solder Joint Goals: Changed all Negative solder joint goal values to zero 0 Changed Fabrication Tolerance from 0.05 to zero 0 Changed Assembly Tolerance from
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1846&OB=DESC.html
!! NEW: IPC-7351C Solder Joint Goals: Changed all Negative solder joint goal values to zero 0 Changed Fabrication Tolerance from 0.05 to zero 0 Changed Assembly Tolerance from
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-01-released_topic1846.xml
2016.01 was just released!!NEW:IPC-7351C Solder Joint Goals:Changed all Negative solder joint goal values to zero 0Changed Fabrication Tolerance from
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Tuttle, Cree, Inc. High Power LED Solder Joint Reliability Session 1 - Predicting Component Life + Under harsh environmental conditions like corrosion, radiation, high temperature and vibration, the aging of components is drastically accelerated. Dr
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-to-present-at-smta-guadalajara-expo-and-tech-forum
. Manual Soldering Selective vs. Wave Soldering AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards Contact Us Global Sales
| https://www.eptac.com/soldertips/soldertips-soldering-iron-calibration-do-you-really-have-to/
. The recovery rate of the iron should also be defined to verify the that the system does not overshoot the top side temperature which would allow a solder joint to be created at a high temperature
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/ball-shear
Electronic interconnects such as solder balls and wire bonds can be sheared individually using a tool accurately positioned above the device’s surface. Force and displacement are measured throughout the test
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-soldering-iron-calibration-do-you-really-have-to
. The recovery rate of the iron should also be defined to verify the that the system does not overshoot the top side temperature which would allow a solder joint to be created at a high temperature
| https://www.eptac.com/soldertip/soldertips-soldering-iron-calibration-do-you-really-have-to/
. The recovery rate of the iron should also be defined to verify the that the system does not overshoot the top side temperature which would allow a solder joint to be created at a high temperature
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